1. Symposium Transsonicum III
Author: edited by J. Zierep, H. Oertel.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Engineering.,Machinery.,Mechanics.,Physics.,Thermodynamics.
2. The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Author: by Gerard Kelly.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Computer engineering.,Engineering.,Machinery.,Mechanics.,Surfaces (Physics).,Systems engineering.
3. Turbulence Management and Relaminarisation
Author: edited by H. W. Liepmann, R. Narasimha.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Engineering.,Hydraulic engineering.,Machinery.,Mechanics.,Physics.,Thermodynamics.
